MRZG2LS-BAA

CLASSIFICATION

微控制器、微处理器、FPGA 模块

manufacturer

ARIES Embedded

type

SOM RZ/G2L

encapsulation

package

Bag

RoHS

YES

price

available options

price inquiry

inventory：1615

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specifications

Operating Temperature

-40°C ~ 85°C

Part Status

Active

Module/Board Type

MCU Core

Co-Processor

Speed

1.5GHz

RAM Size

1GB

Core Processor

ARM® Cortex®-A55, ARM® Cortex®-M33

Connector Type

Pin(s)

Flash Size

4GB eMMC, 128MB (NOR)

Size / Dimension

32.283" L x 19.685" W (820.00mm x 500.00mm)